The Novel Copper Paste "CUX-R"

We introduce the novel copper paste �gCUX-R�h, which can be applied for metallization of ceramics substrate by means of a screen-printing process and heat treatment, at about 900�‹C in a N2 atmosphere. CUX-R is mainly composed of polymer, organic solvent, copper particles (the diameter is a few micrometer) and nano-sized copper oxide particles. The use of nano-sized copper particles is much different then the conventional copper paste and promotes useful application to form copper circuit pattern onto ceramics substrate.
�gCUX-R�h includes no environmental pollutant as well as fabricates well-adhered copper circuit pattern onto ceramics substrates such as 96% Al2O3, highly pure Al2O3 (99% Al2O3) and Aluminum Nitride (AlN), where nano-sized copper oxide particles play an important role for achieving reliable bonding between copper film and ceramics substrates through chemical interaction. We believe that CUX-R is suited for application to LED packages, power modules, the mounting substrate of the package and so on, because the paste can inexpensively fabricate reliable circuit patterns onto AlN substrate that has an advantage of high radiation.