Electronic materials and coating materials
Electronic materials and coating materials

Metallized ceramic substrates

Also employed for forming circuits and electrodes on ceramic substrates and via fillingWe carry out surface metallization as well as via-filling of ceramic substrates with copper paste or silver paste. The use of ceramic substrates enables high levels of heat conduction and reliability. We also carry out other processing such as laser drilling, polishing and plating.

Thick film circuit board

Our thick film circuit board can be used to form semiconductor circuits on ceramic substrates with screen printing, achieving substrates with high heat resistance and heat conduction.

  • Metallized ceramic substrates 1
  • Metallized ceramic substrates 2

Benefits

  • Achieves good adhesion with aluminum nitride substrates, as well
  • Compatible with plating
  • Allows work with conductors having films of different thicknesses in some locations
  • With conductive filled-via, enables high-quality processing for conduction between surfaces
  • By using nano particle paste, also compatible with glass substrates
  • Includes no lead or other environmentally hazardous substances

Specifications

Processing specification
Item Type Remarks
Substrate materialCopper paste Aluminum nitride, Alumina  
Silver paste Aluminum nitride, Alumina, Glass substrates  
Size of substrate □50-114mm Please consult with us about other applications.
Thickness 0.2mm- Please consult with us for substrate thicknesses of 0.20mm or less.
Surface pattern    
L/S 100/100μm  
Film thickness 10-100μm Please consult with us for applications of 100μm or more.
Hole diameter 0.10-2.0mm May differ, depending on thicknesses.
Hole diameter aspect ratio 10-0.5 May differ, depending on hole diameter and thickness.
Processed substrate characteristics
Item Characteristic value
Specific resistance of surface conductor Cu 5μΩ·cm or less
Ag 3μΩ·cm or less
Specific resistance of filling conductor Cu 8μΩ·cm or less
Ag 4μΩ·cm or less
Filling section asperities (no lapping) ±30μm or less
Filling section asperities (with lapping) ±3μm or less

Example of use

Circuit boards, chip components, LED packages, thermoelectric modules, boards for power source control modules, etc.

Substrate with filled via

Substrate with filled via using our highly conductive, zero-shrinkage filling method can be used to clear various types of stringent reliability tests, and is used on substrates for artificial satellites.

  • Substrate with filled via1
  • Substrate with filled via2

Benefits

  • Achieves an even fill, with few voids and crevices
  • Enables miniature, high-density wiring due to low surface asperity in the filled area, COB mounting and pad on via formation on component terminal lands
  • As thermal conductivity of the filled areas is high, can be used as thermal vias for surface-mounted components
  • Compatible with holes with a high aspect ratio, large-diameter holes, combinations of holes of differing diameters, irregularly shaped holes and low-quality holes
  • Fill area bonds tightly to the substrate and achieves moderate porosity in the interior for superior reliability
  • Copper or silver can be selected as fill materials.
  • Compatible with surface plating after filling
  • All materials used are free of lead and other environmentally hazardous substances

Specifications

Item Type Remarks
Substrate material Cu fill AIN, Alumina, Silicon nitride, Machinable ceramic  
Ag fill AIN, Alumina, Silicon nitride, Machinable ceramic, Glass substrates  
Size of substrate □50-114mm May differ, depending on hole diameter and thickness.
Thickness 0.2-2.0mm Please consult with us for substrate thicknesses of 0.20mm or less, or 2.0mm or more.
Hole diameter 0.10-2.0mm May differ, depending on thicknesses.
Hole diameter aspect ratio 10-0.5 May differ, depending on hole diameter and thickness.
Processed substrate characteristics
Item Characteristic value Remarks
Specific resistance of filling conductionCu 8μΩ·cm or less  
Ag 4μΩ·cm or less  
Filling section asperities (no lapping) ±30μm or less  
Filling section asperities (with lapping) ±3μm or less  

Example of use

Various package substrates requiring high reliability and heat conduction, module substrates, etc.

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